Marking machine principle:

UV laser marking machine is the use of high energy density laser beam, the workpiece surface machine for local irradiation, so that the surface material quickly vaporized or color change, so as to reveal the deep material or lead to chemical and physical changes in the surface material engraved traces, or are burned off part of the material through light energy, showing the required etching graphics, text.

Model features:
1. Using the German semiconductor laser pump, optical resonant cavity for 3 times the frequency of the output 355nm wavelength laser, electro-optical conversion efficiency of high beam quality for TEM100 mode.

2. UV laser is a cold light source, heat-affected zone is small, excellent beam quality to create a super fine marking effect.

3. Using imported scanning, marking speed is fast, while suitable for micro cutting and drilling.

4. Ultra-high peak power high and very little thermal effect characteristics, very suitable for aluminum oxide, zirconium oxide ceramic drilling and cutting.

5. 20,000 hours free maintenance of the laser, no consumables, low cost of use, power saving and energy saving.

6. One modular design, easy maintenance, compact size.

7. Marking environmental protection, in line with ROHS standards.

8. Software can receive DXF, PLT, BMF, AI, JPG and other formats, and can automatically generate the flow number and production date, bar code, two-dimensional code.

Automatic UV laser marking machine diagram
Advantages of the machine.

1. UV laser is a cold light source, laser cutting or marking when the thermal impact is particularly small, more suitable for deep processing of materials sensitive to thermal impact.

2. Violet laser has a narrower pulse width and higher peak power, the ceramic sapphire and other materials with a higher damage threshold is easy to break through their damage threshold, so it is easy to process polymer materials with high damage threshold requirements.

3. The UV laser focused spot can be as small as 15UM, so it is very suitable for micro-hole drilling processing.

UV laser marking machine accessories diagram
Applicable materials.

Metal and a variety of non-metallic materials, ceramics, sapphire chips, glass, light-transmitting polymer materials, plastics.

Applicable industries.

Consumer electronics, cell phone components, LCD screen engraving 2D code and trademark, ceramics, sapphire chips, FPC flexible circuit board micro-hole drilling, cutting biomedical glass etching, capacitive touch screen ITO etching.

Technical parameters.

Parameter

Model UV-3W/5W UV-10W

Laser type/wavelength Nd:Yvo/355nm

Excitation source semiconductor 808nm pump source

Maximum laser power 3W/5W 10W

Beam quality M? 1.1 1.3

Q frequency 0-90kHz

Marking minimum character 0.1mm

Marking minimum line width 0.01mm 0.015mm

Marking speed 400 characters/sec 500 characters/sec

Repeat accuracy ±0.001mm

Engraving range 110×110mm or 180×180mm optional

External dimensions 900×680×1200mm

Weight of the machine 120kg

Power requirement 220V/50Hz/10A

Cooling mode water cooling

Machine power 1.2KW 1.5KW

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